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Three-Dimensional Analog Neuro Network - Revision Chip (3DANN-R) Imaging Chip on a Circuit Board

This 3DANN-R (Three-Dimensional Analog Neuro Network - Revision Chip) cube is wire-bonded to the backside of the system circuit board. This demonstrates how the advanced chip is connected to an interface, which allows it to be loaded with instructions that enable it to perform complicated image processing tasks. It is especially good at searching for objects, such as craters on a planet or details of terrain on Earth. Low power consumption, combined with high performance are key attributes to this innovative technology.

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Space Saving Cube